Dear Aneliya Karadzhinova,
We are pleased to inform you that your contribution:
Characterization of Ni/SnPb-TiW/Pt Flip Chip Interconnections in Silicon Pixel Detector Modules
has been accepted for an Oral presentation in the track
Sensors: 1e) Novel technologies.
We are looking forward to see you in Amsterdam,
Niels van Bakel,
On behalf of the track conveners and the local organizing committee