tipp2014

tipp2014@nikhef.nl

1261 discussions

[Tipp2014] TIPP 2014 abstract evaluation update
by Jan Visser 05 Mar '14

05 Mar '14

Dear Cinzia and Shuxia, The abstract submission will be closed tomorrow, Friday February 28 and we would like to give you some further information to complete the rating of all abstracts. We expect to have in your session 10 talks of 20 min, but we will only finalise this number after all abstracts have been rated. It is possible that we will increase the number of slots in your session as there is still room in the overall programme. Therefore, we ask you to propose for talks all the abstracts that meet your requirements for a talk, as we can always reward a poster presentation to the ones we cannot accept as a talk. Ideally, we would like to receive a ranking list to facilitate the assignment of the exact number of talks to each track. We would appreciate if you could complete the rating by Wednesday March 12. Thanks in advance for your kind cooperation, looking forward to seeing you in Amsterdam, Jan Visser on behalf of the local organising committee

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[Tipp2014] Clarence Chang
by Tezak, Samantha L. 04 Mar '14

04 Mar '14

Dear Conference Secretary, Good day. I am a secretary at Argonne National Laboratory for Clarence Chang. Clarence has submitted travel request to me to attend the TIPP. Please provide me with a name and phone number of the conference host. This is required for me to continue processing the request for his travels. Thank you in advance. Kind Regards, Samantha *************************************** Samantha L Tezak Administrative Secretary High Energy Physics Division<http://www.hep.anl.gov/> Argonne National Laboratory 9700 S. Cass Avenue, Bldg. 360 Argonne, IL 60439 Tel: (630) 252-6250 Fax: (630) 252-3998 E-mail: stezak(a)anl.gov<mailto:stezak@anl.gov> **************************************** P Please consider the environment before printing this e-mail

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[Tipp2014] [Indico] New abstract submission: GAJANANA, Deepak
by noreply-indico-team＠cern.ch 04 Mar '14

04 Mar '14

The following email has been sent to GAJANANA, Deepak: === Dear Deepak Gajanana, The submission of your abstract has been successfully processed. Abstract submitted: <https://indico.cern.ch/event/192695/call-for- abstracts/my-abstracts>. Status of your abstract: <https://indico.cern.ch/event/192695/call- for-abstracts/419/>. See below a detailed summary of your submitted abstract: Conference: Tipp 2014 - Third International Conference on Technology and Instrumentation in Particle Physics Submitted by: GAJANANA, Deepak Submitted on: 04 March 2014 14:47 Title: Application Specific Photonic Integrated Circuits for High Energy Physics Applications Abstract content Physics experiments generally deal with enormous data throughput. The density of the data is increasing with upgrades on the detectors and experiments. Fiber optic communication with its high bandwidth and high capacity provides an effective solution. In experiments like the KM3NeT, cost-effective long haul optical communication is desired. A Dense Wavelength Division Multiplexed (DWDM) based multi-channel readout with minimum number of fibres over a large distance is a significant challenge. However, in the detectors at the Large Hadron Collider (LHC) or similar facilities, distances are short, but the optical readout systems are exposed to radiation. So, radiation hardness of optical links and/or circuits is an important requirement. Photonic integrated circuit design is going through an exciting phase with generic integration philosophy. Thanks to the availability of MPWs, it is getting easier to design and test an Application Specific Photonic Integrated Circuit (ASPIC). With such broad range of physics applications, we demonstrate examples of ASPICs designed for high energy physics using generic integration platforms. Summary Primary Authors: GAJANANA, Deepak (NIKHEF (NL)) <deepak.gajanana(a)cern.ch> Co-authors: VAN BEUZEKOM, Martin (NIKHEF (NL)) <martin.van.beuzekom(a)cern.ch> Dr. LEIJTENS, Xaveer (Eindhoven University of Technology) <x.j.m.leijtens(a)tue.nl> Prof. SMIT, Meint (Eindhoven University of Technology) <m.k.smit(a)tue.nl> Abstract presenters: GAJANANA, Deepak Track classification: Data-processing: 3b) Trigger and Data Acquisition Systems Emerging technologies: 4d) Photonics Presentation type: Oral Comments:

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[Tipp2014] [Indico] New abstract submission: GAJANANA, Deepak
by noreply-indico-team＠cern.ch 04 Mar '14

04 Mar '14

The following email has been sent to GAJANANA, Deepak: === Dear Deepak Gajanana, The submission of your abstract has been successfully processed. Abstract submitted: <https://indico.cern.ch/event/192695/call-for- abstracts/my-abstracts>. Status of your abstract: <https://indico.cern.ch/event/192695/call- for-abstracts/418/>. See below a detailed summary of your submitted abstract: Conference: Tipp 2014 - Third International Conference on Technology and Instrumentation in Particle Physics Submitted by: GAJANANA, Deepak Submitted on: 04 March 2014 14:41 Title: On chip design in the KM3NeT experiment Abstract content The KM3NeT collaboration is building a large underwater neutrino telescope in the Mediterranean Sea. The detector operates by detecting Cherenkov light produced by the charged products of neutrino interactions in seawater. The detection is done by digital optical modules (DOMs), which each house 31 3 inch photomultiplier tubes (PMTs). A custom, low power, PMT base was developed to provide the high voltage by means of a Cockroft-Walton (CW) multiplier circuit, and to amplify and pre-process the PMT signals. At the core of the base design are two ASIC's, which we will describe in this contribution: 1. PROMiS: A mixed signal ASIC which amplifies the PMT signal and provides digital information on LVDS lines to the central logic board in each DOM. The photon arrival time is provided with <2ns accuracy, while a time-over-threshold measurement encodes the pulse charge. Each chip is uniquely identified using a 24-bit one-time-programmable memory and communication with the chip is achieved using the I2C protocol. 2. CoCo: An analog ASIC which provides pulses to charge the CW circuit and controls the feedback of the high voltage. Both ASICs have recently been produced and packaged in large numbers. Automated functional tests have been performed. The chips also went through Quality and Reliability tests. The paper will discuss the design, production challenges and the test results. Summary Primary Authors: GAJANANA, Deepak (NIKHEF) <deepakg(a)nikhef.nl> Co-authors: TIMMER, Paul (Nikhef) <pault(a)nikhef.nl> GROMOV, Vladimir (NIKHEF (NL)) <vgromov(a)nikhef.nl> Abstract presenters: GAJANANA, Deepak Track classification: Experiments: 2c) Detectors for neutrino physics Data-processing: 3a) Front-end Electronics Presentation type: Oral Comments:

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[Tipp2014] TIPP 2014 abstract evaluation update
by Jan Visser 04 Mar '14

04 Mar '14

Dear Katsuo and Brian, The abstract submission will be closed tomorrow, Friday February 28 and we would like to give you some further information to complete the rating of all abstracts. We expect to have in your session 20 talks of 20 min, but we will only finalise this number after all abstracts have been rated. It is possible that we will increase the number of slots in your session as there is still room in the overall programme. Therefore, we ask you to propose for talks all the abstracts that meet your requirements for a talk, as we can always reward a poster presentation to the ones we cannot accept as a talk. Ideally, we would like to receive a ranking list to facilitate the assignment of the exact number of talks to each track. We would appreciate if you could complete the rating by Wednesday March 12. Thanks in advance for your kind cooperation, looking forward to seeing you in Amsterdam, Jan Visser on behalf of the local organising committee

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[Tipp2014] status of the presentation ID: 150, Performance of the EUSO-BALLOON Front-End Electronics
by Hiroko Miyamoto 04 Mar '14

04 Mar '14

Dear organizer, I wonder if you could let me know if my abstracted submitted on 31st of January is still being proceeded or not. My colleague who submitted as well got the accept for her presentation on 18 of February and it also can be seen on the conference webpage. So far I have got no answer or announcement from you and the status of my abstract that I can check on the webpage is still just submitted. My presentation ID is 150, the title is "Performance of the EUSO-BALLOON Front-End Electronics", Track classification is 2b) and 3a). Thank you very much in advance. Best regards, Hiroko -- Hiroko Miyamoto, PhD RBUCE-UP/Marie Curie fellow (Junior Researcher) Laboratoire de l'accelerateur lineaire (LAL) UMR8607 du CNRS Centre Scientifique d'Orsay Bâtiment 200 - BP 34 91898 ORSAY Cedex Tel: +33 (0)1 64 46 89 38 E-mail: miyamoto(a)lal.in2p3.fr Project: JEM-EUSO/EUSO-BALLOON

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[Tipp2014] TIPP 2014 abstract evaluation update
by Jan Visser 04 Mar '14

04 Mar '14

Beste Jeroen, The abstract submission will be closed tomorrow, Friday February 28 and we would like to give you some further information to complete the rating of all abstracts. We expect to have in your session 10 talks of 20 min, but we will only finalise this number after all abstracts have been rated. It is possible that we will increase the number of slots in your session as there is still room in the overall programme. Therefore, we ask you to propose for talks all the abstracts that meet your requirements for a talk, as we can always reward a poster presentation to the ones we cannot accept as a talk. Ideally, we would like to receive a ranking list to facilitate the assignment of the exact number of talks to each track. We would appreciate if you could complete the rating by Wednesday March 12. Thanks in advance for your kind cooperation, looking forward to seeing you in Amsterdam, Jan Visser on behalf of the local organising committee

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[Tipp2014] Need info about my submission
by ygxie 04 Mar '14

04 Mar '14

Dear Mr./Ms. I have registered and sent my abstract to TIPP2014, and hope recieve some response about the acceptance for submission and further invitation letter, etc.. Thank you! 致礼！谢宇广 Best regards， Yuguang Xie Institute of High Energy Physics, CAS Yuquan Lu, Shijingshan District Beijing, 100049, China Phone: +86 10 88236064 Fax: +86 10 88236423 2014-03-04 ygxie

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[Tipp2014] adding authors
by Henry J. Frisch 03 Mar '14

03 Mar '14

Dear Tipp2014, I didn't type in all the authors for our abstract when I submitted it before the 1st deadline as it seemed so lengthy. I did, however, send mail at that time requesting some aid in adding them. I really would like to add them- I feel badly that they're not listed (it was just too much for me to enter all the information- I apologize). Would it be possible to open it so that now I can? I think it will be easier now, as almost all the names are probably already in the CERN db. I really need to do so- it's not proper for me to have only me and Elagin. I've attached the abstract with the names, and am copying it below as well. Many thanks, and apologies, Henry Abstract for TIPP2014 Version 1.0 Jan 28, 2014 The Frugal Tile: A 20-cm-square MCP-PMT Module Comprising 8 Glass Parts Andrey Elagin, Henry J. Frisch, Eric Oberla, Richard Northrop, Matthew Wetstein University of Chicago Bernhard Adams, Joseph Gregar, Jeffrey Elam, Anil Mane, Robert G. Wagner Argonne National Laboratory Michael Minot, Aileen O'Mahony Incom, Inc. Abstract ________ We present the design for the `Frugal Tile', an all-glass MCP-PMT with an active area of 400 square centimeters. The LAPPD glass tile module was designed to be simple, with: a) a hermetic package made of top and bottom plates and a rectangular sidewall, each made of water-jet-cut plate glass; b) an internal stack consisting of 2 glass capillary plates functionalized with Atomic Layer Deposition and 3 glass grid spacers made from waterjet-cut plate glass; and a getter assembly that drops into place. Features of the design are: no pins penetrating the envelope; c) an internal HV divider implemented by resistive coatings on the MCP's and spacers; d) RF-stripline anodes silkscreened on the bottom plate with an analog bandwidth above 1.5 GHz for good spatial and temporal resolution; e) mechanical rigidity provided by atmospheric pressure; and f) modular design for covering large areas. The tile is one component of a modular system in which an array of four tiles sits on a 1800-square-cm `Tray' section that contains the ground plane of the RF strip-lines and supports the waveform sampling and data-acquisition electronics that reads out the strips. -- Henry J. Frisch HEP 320, EFI 5640 S. Ellis Ave. Chicago, Il. 60637 Phone:773-702-7479 Fax:773-834-5959

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[Tipp2014] [Indico] New abstract submission: MUENSTERMANN, Daniel
by noreply-indico-team＠cern.ch 03 Mar '14

03 Mar '14

The following email has been sent to MUENSTERMANN, Daniel: === Dear Daniel Muenstermann, The submission of your abstract has been successfully processed. Abstract submitted: <https://indico.cern.ch/event/192695/call-for- abstracts/my-abstracts>. Status of your abstract: <https://indico.cern.ch/event/192695/call- for-abstracts/417/>. See below a detailed summary of your submitted abstract: Conference: Tipp 2014 - Third International Conference on Technology and Instrumentation in Particle Physics Submitted by: MUENSTERMANN, Daniel Submitted on: 03 March 2014 20:34 Title: Radiation-hard Active Pixel Sensors for HL-LHC Detector Upgrades based on HV/HR-CMOS Technology Abstract content We explore the concept of using deep-submicron HV-CMOS and imaging processes to produce a drop-in replacement for traditional radiation-hard silicon sensors. Unlike fully integrated monolithic active pixel sensors (MAPS), such active sensors contain simple circuits, e.g. amplifiers and discriminators, but still require a readout chip - which can be a traditional strip or pixel readout chip or a tailor-made one without any analogue circuits. This approach yields most of the advantages of MAPS (improved resolution, reduced cost and material budget, etc.), without the complication of full integration on a single chip; in particular, high-speed clocked circuits necessary for trigger handling and efficient communication can be kept separated from the crosstalk-susceptible pre-amplifiers. The design of test ASICs produced in different processes, characterization results before and after irradiation and experience obtained with pixel and strip readout will be shown Finally, plans for further submissions with higher-resistivity substrates will be outlined and an outlook will be given on application options for HL-LHC detector upgrades. Summary Luminosity upgrades are discussed for the LHC which would make upgrades to the LHC detectors necessary, in particular new, even more radiation-hard and granular sensors for the inner detector region. Deep-submicron HV-CMOS processes feature moderate bulk resistivity and HV capability and are therefore good candidates for drift-based radiation-hard monolithic active pixel sensors (MAPS). It is possible to apply up to ~100V of bias voltage leading to a depletion depth of ~10-20 µm. Thanks to the high electric field, charge collection is fast and nearly insensitive to radiation-induced trapping. Due to the still rather high dopant concentration, almost no radiation effect is expected to the depletion voltage. Imaging processes using high-resistivity substrates could provide significantly more signal charge thanks to larger depletion depths and are therefore also studied. We explore the concept of using such HV/HR-CMOS processes to produce a drop-in replacement for traditional radiation hard silicon sensors. Such active sensors contain only simple circuits to amplify and either discriminate or condition the basic pulses created by charged particles. A traditional readout chip is still needed to receive and organize the data from the active sensor and handle high-level functionality such as trigger management. The devices are tested with the ATLAS FE-I4 and Timepix pixel readout chips and the LHCb Beetle and ATLAS ABCN25 strip readout chips. Either strip-like or pixel-like readout can be selected on the same device. While a readout chip is still needed (unlike the case of an ideal monolithic MAPS device), the active sensor approach offers many advantages: such sensors can be fabricated in a fully commercial CMOS process without need for special substrates or processing and will therefore cost less than traditional diode sensors, they can be thinned to the limit of the collection layer resulting in much lower mass, they require relatively low bias voltage, and they can operate at room temperature or with only moderate cooling after irradiation. In addition, they can contain sub-pixels with smaller pitch than the readout chip and improve the spatial resolution compared to standard sensors by encoding the hit sub-pixels in the signal sent to the readout chip. >From a practical perspective, maintaining the traditional separation between sensing and processing functions lowers development cost and makes use of existing infrastructure. Active sensors can also be seen as a first step towards 3D-integrated electronics in which the analogue tier contains the sensor while the digital tier can contain only purely digital circuits. The number of required DC connections between the two tiers could be small while data transmission could be done using AC coupling hence reducing the complexity and required number of inter-chip connections. To explore the performance and radiation hardness of active sensors, so-called HV2FEI4 ASICs were produced in the AMS H18 process. Their (sub-)pixels of 33x125 µm size are combined to match the respective readout chip: for the pixel readout, three HV-CMOS pixels are multiplexed onto one FE-I4 pixel such that the hit pixels are encoded by the pulse height; the chips are just glued to each other, capacitive data transmission is used. In this way, the position resolution of the HV-CMOS sensor can be significantly better than the granularity of the readout chip suggests. For the strip readout, the pixel cells are combined to form virtual strips. Here, the z-position of the hit is encoded via the discriminator's pulse height and can be evaluated by analogue strip readout electronics like the Beetle chip. Future strip readout concepts foresee a digital encoding of the z position using a modified ATLAS readout chip (ABC'). To explore alternative processes, the chip concept was ported to a GlobalFoundries 130 nm HV-CMOS process and first prototypes have been characterised before and after irradiation. In addition, a submission on higher resistive substrates is currently being prepared. The presentation will give an overview of the characterization results of the prototype chips and highlight first results with irradiated and unirradiated samples in the laboratory and in beam tests. Finally, future prospects within the LHC upgrade and beyond will be discussed. Primary Authors: FEIGL, Simon (CERN) <s.feigl(a)cern.ch> MUENSTERMANN, Daniel (Universite de Geneve (CH)) <daniel.muenstermann(a)cern.ch> Co-authors: Abstract presenters: FEIGL, Simon Track classification: Sensors: 1b) Semiconductor Detectors Presentation type: Oral Comments:

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