The following email has been sent to ELAGIN, Andrey:
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Dear Andrey Elagin,
The submission of your abstract has been successfully processed.
Abstract submitted: https://indico.cern.ch/event/192695/call-for- abstracts/my-abstracts.
Status of your abstract: https://indico.cern.ch/event/192695/call- for-abstracts/366/.
See below a detailed summary of your submitted abstract:
Conference: Tipp 2014 - Third International Conference on Technology and Instrumentation in Particle Physics
Submitted by: ELAGIN, Andrey
Submitted on: 28 February 2014 16:47
Title: Development of a 20cm-by-20cm "hot" indium-alloy hermetic seal in an inert atmosphere for photo-detector assembly
Abstract content The Large-Area Picosecond Photo-Detector Collaboration (LAPPD) is currently developing a large-area, modular photo-detector system composed of thin, planar, glass-body modules, each with two 20x20-cm-squared ALD-functionalized MCPs in a chevron geometry. In the case of LAPPD, hermetic sealing between the entrance window and the detector body is complicated by the square shape of the detector and the large area. We have successfully demonstrated a technique to make a vacuum seal for the LAPPD detectors by using an indium-alloy above its melting temperature on a flat pre-coated glass surface in an inert atmosphere. While this technique has been developed in a glove box filled with an inert gas, it can be adapted for the use in a vacuum transfer assembly process.
Summary
Primary Authors: ELAGIN, Andrey (University of Chicago) elagin@hep.uchicago.edu FRISCH, Henry (University of Chicago) frisch@hep.uchicago.edu NORTHROP, Richard (University of Chicago) rnorthro@uchicago.edu
Co-authors: OBAID, Razib (Illinois Institute of Technology) razibobaid@gmail.com HEINTZ, Mary (University of Chicago) maryh@hep.uchicago.edu WETSTEIN, Matthew (University of Chicago) mwetstein@uchicago.edu ADAMS, Bernhard (Argonne National Laboratory) adams@aps.anl.gov
Abstract presenters: ELAGIN, Andrey
Track classification: Sensors: 1d) Photon Detectors Sensors: 1e) Novel technologies
Presentation type: Oral
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