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Dear Ronald Lipton,
The submission of your abstract has been successfully processed.
Abstract submitted: https://indico.cern.ch/userAbstracts.py?confId=192695.
Status of your abstract: https://indico.cern.ch/abstractDisplay.py?abstractId=19&confId=192695.
See below a detailed summary of your submitted abstract:
Conference: Tipp 2014 - Third International Conference on Technology and Instrumentation in Particle Physics
Submitted by: Dr. LIPTON, Ronald
Submitted on: 21 January 2014 21:26
Title: Three Dimensional Integrated Circuits for Large Area Arrays
Abstract content Three dimensional integrated circuit technologies offer the possibility of fabricating large area arrays of sensors integrated with complex electronics with minimal dead area. We describe the current status of two demonstration projects. The first is to integrate 3D electronics with active edge sensors to produce "active tiles" which can be tested and assembled in to arrays of arbitrary size with high yield. This includes studies of possible post-processing to achieve active edges without the complexity of silicon-on-insulator sensor assemblies. The second is to explore the use of silicon or glass interposers (2.5 D) to assemble arrays that integrate and match the pitch of large area sensors with arrays of readout integrated circuits.
Summary
Primary Authors: Dr. LIPTON, Ronald (Fermi National Accelerator Lab. (US)) ronald.lipton@cern.ch Dr. DEPTUCH, Grzegorz (Fermi National Accelerator Lab. (US)) grzegorz.wladyslaw.deptuch@cern.ch
Co-authors:
Abstract presenters: Dr. DEPTUCH, Grzegorz
Track classification: Emerging technologies: 4c) 3D integration
Presentation type: --not specified--
Comments: