Dear Aneliya Karadzhinova,

We are pleased to inform you that your contribution: Characterization of Ni/SnPb-TiW/Pt Flip Chip Interconnections in Silicon Pixel Detector Modules has been accepted for an Oral presentation in the track Sensors: 1e) Novel technologies.

We are looking forward to see you in Amsterdam,

Niels van Bakel, On behalf of the track conveners and the local organizing committee