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Dear Ronald Lipton,

The submission of your abstract has been successfully processed.

Abstract submitted: https://indico.cern.ch/userAbstracts.py?confId=192695.

Status of your abstract: https://indico.cern.ch/abstractDisplay.py?abstractId=14&confId=192695.

See below a detailed summary of your submitted abstract:

Conference: Tipp 2014 - Third International Conference on Technology and Instrumentation in Particle Physics

Submitted by: Dr. LIPTON, Ronald

Submitted on: 16 January 2014 15:57

Title: Performance of Three Dimensional Integrated Circuits Bonded to Sensors

Abstract content We report on the processing and performance of 3D integrated circuits (3DIC) bonded to silicon sensors. The circuits were part of the Fermilab-sponsored two-tier 0.13 micron run at Tezzaron/ Global Foundries. They include designs for the CMS track trigger, ILC vertex detectors, and x-ray correlation spectroscopy. Sensors were bonded to the 3DICs using die-to-die solder ball bonding as well as with a chip-to-wafer oxide bonding process (Ziptronix DBI) similar to the wafer-to-wafer bonding process used for the 3DICs.

Summary

Primary Authors: Dr. LIPTON, Ronald (Fermi National Accelerator Lab. (US)) ronald.lipton@cern.ch

Co-authors: Dr. DEPTUCH, Grzegorz (Fermi National Accelerator Lab. (US)) grzegorz.wladyslaw.deptuch@cern.ch HOFF, Jim (Fermilab) jimhoff@fnal.gov THOM, Julia (Cornell University (US)) julia.thom@cern.ch WITTICH, Peter (Cornell University (US)) pw94@cornell.edu YE, Zhenyu (Fermi National Accelerator Lab. (US)) zhenyu.ye@cern.ch SIDDONS, Peter (Brookhaven National Laboratory) siddons@bnl.gov Prof. TRIPATHI, Mani (University of California Davis (US)) sudhindra.mani.tripathi@cern.ch HEINTZ, Ulrich (Brown University (US)) ulrich_heintz@brown.edu NARAIN, Meenakshi (Brown University (US)) narain@hep.brown.edu Mr. YAREMA, Ray (FNAL) yarema@fnal.gov GRYBOS, Pawel (High Energy Department) grybos@ftj.agh.edu.pl SZCZYGIEL, Robert (AGH UST) robert.szczygiel@agh.edu.pl TRIMPL, Marcel (Fermilab) trimpl@fnal.gov

Abstract presenters: Dr. LIPTON, Ronald

Track classification: Emerging technologies: 4c) 3D integration

Presentation type: --not specified--

Comments: